Intel Xeon E3-1230v6 Xeon E3 3.5 GHz - Skt 1151 Kaby Lake
P/N: BX80677E31230V6
Producent:
Intel
Czas dostawy: ok. 4-5 dni
0,00 zł netto
Intel Xeon E3-1230V6. Processor family: Intel® Xeon® E3 v6, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.9 GHz. Package width: 70 mm, Package depth: 116 mm, Package height: 101 mm
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Intel Xeon E3-1230V6, Intel® Xeon® E3 v6, LGA 1151 (Socket H4), 14 nm, Intel, E3-1230 v6, 3.5 GHz |
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Xeon® Processor E3-1230 v6 (8M Cache - 3.50 GHz) |
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Group | CPUs | |||
Manufacturer | Intel | |||
Manufacturer item no. | BX80677E31230V6 | |||
EAN/UPC | 5032037094665 | |||
Description | ||||
Intel Xeon E3-1230V6. Processor family: Intel® Xeon® E3 v6, Processor socket: LGA 1151 (Socket H4), Processor lithography: 14 nm. Memory channels: Dual-channel, Maximum internal memory supported by processor: 64 GB, Memory types supported by processor: DDR4-SDRAM, DDR3L-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 2x8, 1x8+2x4, Supported instruction sets: SSE4.1, SSE4.2, AVX 2.0. Intel® Turbo Boost Technology 2.0 frequency: 3.9 GHz. Package width: 70 mm, Package depth: 116 mm, Package height: 101 mm
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Main features | ||||
General | ||||
Processor family | Intel® Xeon® E3 v6 | |||
Processor socket | LGA 1151 (Socket H4) | |||
Processor lithography | 14 nm | |||
Memory channels | Dual-channel | |||
Maximum internal memory supported by processor | 64 GB | |||
Maximum internal memory | 65536 MB | |||
Memory types supported by processor | DDR4-SDRAM, DDR3L-SDRAM | |||
Market segment | Server | |||
PCI Express configurations | 1x16, 2x8, 1x8+2x4 | |||
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 | |||
Intel® Turbo Boost Technology | 2.0 | |||
Intel® Turbo Boost Technology 2.0 frequency | 3.9 GHz | |||
Package width | 70 mm | |||
Package depth | 116 mm | |||
Package height | 101 mm | |||
Opis
- Cache
- 8MB
- CPU socket type
- Intel Socket 1151 (Core i)
- CPU shipping type (i.e. box, tray, ...)
- Box set
- Chip frequency
- 3GHz