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Hewlett Packard Enterprise Intel Xeon X7350. Processor family: Intel® Xeon® 7000 Sequence, Processor lithography: 65 nm, Processor model: X7350. Market segment: Server, Number of Processing Die Transistors: 582 M, Processing Die size: 286 mm². Processor package size: 53.3 mm. Intel® Virtualization Technology (Intel® VT): VT-x
HPE Intel Xeon X7350 - Intel® Xeon® 7000 Sequence - Server-workstation - 65 nm - 2.93 GHz - X7350 - 64-bit
P/N: 452457-001
Producent:
HPE
Czas dostawy: ok. 4-5 dni
0,00 zł netto
Hewlett Packard Enterprise Intel Xeon X7350. Processor family: Intel® Xeon® 7000 Sequence, Processor lithography: 65 nm, Processor model: X7350. Market segment: Server, Number of Processing Die Transistors: 582 M, Processing Die size: 286 mm². Processor package size: 53.3 mm. Intel® Virtualization Technology (Intel® VT): VT-x
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| HPE Intel Xeon X7350, Intel® Xeon® 7000 Sequence, 65 nm, X7350, 2.93 GHz, 64-bit, Server/workstation |
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| Intel Xeon X7350 - 8M Cache - 2.93 GHz - 1066 MHz FSB | ||||
| Group | CPUs | |||
| Manufacturer | HPE | |||
| Manufacturer item no. | 452457-001 | |||
| Description | ||||
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Options, accessories, services and support for all your HP and Compaq products.
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| Main features | ||||
| General | ||||
| Processor family | Intel® Xeon® 7000 Sequence | |||
| Processor lithography | 65 nm | |||
| Processor model | X7350 | |||
| Market segment | Server | |||
| Number of Processing Die Transistors | 582 M | |||
| Processing Die size | 286 mm² | |||
| Processor package size | 53.3 mm | |||
| Intel® Virtualization Technology (Intel® VT) | VT-x | |||
Opis
- Cache
- CPU socket type
- Chip frequency
- Frontside bus